Microwave/Millimeter-Wave Packaging for 5G and Beyond: Materials, Technologies, and Techniques [From the Guest Editors’ Desk]
نویسندگان
چکیده
It is our pleasure to write this column and introduce the IEEE Microwave Magazine reader focus issue “Microwave/Millimeter-Wave Packaging for 5G Beyond.” This was inspired by past presidents of IEEE Theory Technology Society (MTT-S) as a means promote visibility other Societies within MTT-S activities. The sponsored Technical Committee (TC)-16, Millimeter-Wave Packaging, Interconnect Integration. Advanced microwave millimeter-wave (mm-wave) packaging multidisciplinary research area where transdisciplinary innovation key enabling challenging applications mm-wave. As result, in parallel with MTT-S, several societies are working address these issues.
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ژورنال
عنوان ژورنال: IEEE Microwave Magazine
سال: 2022
ISSN: ['1527-3342', '1557-9581']
DOI: https://doi.org/10.1109/mmm.2022.3173478